Miniaturization Drives Innovation
With global electronics leaning toward thinner, smaller, and more efficient designs, traditional insulation methods like tapes or resin sheets have become bulky, expensive, and unsuitable for evolving demands. The FI finish from Nippon Kinzoku addresses this directly. By pre-coating the stainless steel with an ultra-thin inorganic layer (about 0.5 to 1μm), the need for additional insulation materials is eliminated, helping manufacturers streamline assembly processes and shrink device size.
FI Finish: Function Meets Sustainability
This new FI finish is not just functional, it is eco-friendly. Classified as an “Eco-Product” by Nippon Kinzoku’s internal environmental criteria, it enables reduced carbon emissions by eliminating customer-side insulation treatments. It also supports the company’s broader commitment to achieving Net Zero CO₂ emissions by 2050. The product’s robust, scratch-resistant surface also contributes to a longer lifespan, which is another plus for sustainability in hardware manufacturing.
Engineering Prowess & Product Specifications
Nippon Kinzoku’s FI finish isn’t limited to one type of steel. It is currently applicable to stainless steel types like SUS304, SUS301, and SUS430, among others. With coating thicknesses ranging between 0.5 to 1μm and usable strip thickness from 0.05 to 0.15mm, the material can be produced in widths up to 500mm. Its heat resistance reaches an impressive 850°C, and surface insulation resistance is rated at 50MΩ or more, making it suitable for demanding electronic environments and sliding parts alike.
Manufacturing Backbone
The product’s excellence is a result of Nippon Kinzoku’s decades-long expertise in cold-rolling stainless steel. Their advanced rolling technology and proprietary equipment allow them to customize products based on unique customer requirements. This adaptability helps serve a wide range of sectors from consumer electronics and entertainment to renewable energy, automotive, and more.
Industry Integration & Commercial Focus
With an eye on the growing market for miniaturized electronics, secondary batteries, and mobile tech, Nippon Kinzoku is poised to expand sales of its FI finish. Its performance and environmental benefits make it ideal for integration into high-tech devices and sustainable manufacturing chains. The product reflects a shift toward materials innovation, where every micro-layer is engineered for maximum impact, both mechanically and ecologically.
Toward Carbon Neutrality: A Material Step
The FI finish embodies Nippon Kinzoku’s broader mission of green innovation. By integrating insulation into the metal itself, the company reduces material waste, manufacturing steps, and operational emissions. Their commitment to carbon neutrality by 2050 drives this kind of product development, merging material science with environmental responsibility.
Key Takeaways:
• FI finish is a stainless steel coated with an inorganic insulating layer (0.5–1μm thick).
• Provides high electrical insulation (≥ 50MΩ) & heat resistance up to 850°C.
• Helps achieve miniaturization in electronics by removing the need for added insulation.
• Reduces costs, increases productivity & simplifies the manufacturing process.
• Classed as an “Eco-Product” due to its carbon-saving manufacturing approach.
• Applicable to SUS304, SUS301, SUS430 & other steel types.
• Thickness ranges from 0.05–0.15mm; width up to 500mm.
• Part of Nippon Kinzoku’s Net Zero CO₂ emissions goal by 2050.
• Target applications: smartphones, batteries, game consoles & more.
• Enhances scratch resistance & durability for sliding or moving parts.
• Developed using advanced cold-rolling techniques & proprietary machinery.
• Designed to replace tapes & resins, removing bottlenecks in design evolution.
• Reduces carbon footprint & material waste at customer sites.
• Offers customized specs for diverse industrial needs.
• Nippon Kinzoku is expanding sales & industrial collaborations globally.
• Supported by a dedicated Production Process & Support Department.
• Product contributes to sustainability efforts in electronics & green tech sectors.
• Especially suitable for compact, heat-sensitive environments.
