EV Group, a prominent supplier of wafer bonding and lithography equipment, and Fraunhofer IZM-ASSID, a division of Fraunhofer IZM renowned for applied research in semiconductor 3D wafer-level system integration, have announced a strategic partnership to advance alternative bonding and debonding technologies for cutting-edge CMOS and heterogeneous integration applications, with a focus on quantum computing.
The partnership commences with the installation of an EVG850 automated laser debonding system at Fraunhofer's newly established Center for Advanced CMOS and Heterointegration Saxony in Dresden, Germany. CEASAX combines the expertise of Fraunhofer IZM-ASSID and the Fraunhofer Institute for Photonic Microsystems to further research into 300-mm, 3D heterogeneous wafer-level system integration and front-end semiconductor integration processes for high-performance neuromorphic computing, cryo- and quantum technology.
The EVG850 DB is the inaugural system to be installed at CEASAX, enabling Fraunhofer IZM-ASSID to bridge critical process gaps and offer technology modules for manufacturing quantum systems and their wafer-scale hardware environment based on a 300-mm cleanroom environment. The system's installation also marks the launch of Fraunhofer's Bond-Hub, which will feature a range of leading-edge temporary and permanent wafer-to-wafer and die-to-wafer bonding systems.
Temporary wafer bonding is a crucial method for processing thin wafers, under 100-micron silicon thickness, which are essential for 3D ICs, power devices, and fan-out wafer-level packaging, FOWLP, as well as for handling fragile substrates like compound semiconductors. The debonding of the carrier wafer is a vital step in preparing the device wafer for final processing toward singulation and integration of the dies into the end device or application. With the EVG850 DB system, Fraunhofer can perform these debonding processes entirely in-house, significantly reducing development times for optimal process flows with various bonding adhesive systems. This capability allows Fraunhofer to tailor its processes to the unique and specific needs of its diverse customer base.
Manuela Junghähnel, site manager at Fraunhofer IZM-ASSID, expressed excitement about expanding and reinforcing the partnership with EV Group through the acquisition of the EVG850 DB laser debonding and cleaning system, the first of several key product installations at CEASAX. This expanded relationship provides Fraunhofer with state-of-the-art technology in-house and a strong partner in EV Group for developing new technologies for 3D device integration, offering customers a more complete process chain for 3D/heterogeneous integration from a single source.
Markus Wimplinger, corporate technology development and IP director at EV Group, emphasized the importance of building upon the long-term partnership with Fraunhofer to advance quantum computing applications and beyond. This expanded collaboration allows EVG to remain at the forefront of technology advancements and contribute to the development of new manufacturing processes for quantum systems.
EVG's wafer bonding, lithography, and metrology solutions enable the development and high-volume manufacturing of technology innovations in advanced packaging, MEMS, and compound semiconductors. Recent breakthroughs in hybrid bonding, wafer bond alignment technology, IR laser release technology, maskless exposure for fan-out wafer-level packaging, and NIL and resist processing for wafer-level optics manufacturing demonstrate EVG's technology leadership in heterogeneous integration and wafer-level packaging.
The EVG850 DB fully automated UV laser debonding and cleaning system enables high-throughput, low-cost-of-ownership room-temperature debonding for ultra-thin and stacked fan-out packages. It incorporates a solid-state UV laser and proprietary beam-shaping optics to enable optimized, force-free carrier lift-off.
This strategic partnership between EV Group and Fraunhofer IZM-ASSID strengthens their collaboration in developing cutting-edge bonding and debonding technologies for advanced CMOS and heterogeneous integration applications, with a particular emphasis on quantum computing. The installation of the EVG850 DB system at CEASAX marks a significant milestone in this partnership, enabling Fraunhofer to offer comprehensive process chains for 3D/heterogeneous integration while staying at the forefront of technology advancements in the field.
